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首頁 > 產品技術 > SiC Process
SiC Process

 

 

 

Episil Technologies has established a completed Silicon Carbide foundry line on 4" and 6" with dedicated tools for SiC Processing, e.g. High Temperature Anneal up to 1,900°C , High Temperature Implant up to 500°C , dedicated Gate Oxide Furnace, SiC Wafer Thinning, Backside Laser Anneal, etc. EpiSil Technologies provides verified process platform of both SiC- Shottky diode and SiC- MOSFET for customers design-in, and do available to co-develop for customized process. Except the foundry services for fabless design houses, Episil technologies is also capable for IDMs who looks for outside second source solution.

 

 HEMT Process List

     

Wafer Size              

: 4" 6"

Standard Process     

: JBS, DMOS

Minimum width(CD)

: 0.6um

Etcher

: SiC / SiO2 / Si3N4 / Poly / Metal, both Dry Etch and Wet Etch  

CVD

: PSG / BPSG / TEOS, LPCVD / PECVD / APCVD

Implant

: B/P/Sb at room temp; Al/N/P 500°C  at high temp

Furnace                   

: 1300°C ~1,900°C  annealing,  900~1,350°C  Oxides/N2O/NO/N2/Ar

Anneal

: RTP / Laser Anneal

Grinding

: down to 150um

Metallization

:  Ti , TiN , Al/Cu , Ag , Au , Ni

 

 

 

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