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首頁 > 產品技術 > SiC Process
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SiC Process
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Episil Technologies has established a completed Silicon Carbide foundry line on 4" and 6" with dedicated tools for SiC Processing, e.g. High Temperature Anneal up to 1,900°C , High Temperature Implant up to 500°C , dedicated Gate Oxide Furnace, SiC Wafer Thinning, Backside Laser Anneal, etc. EpiSil Technologies provides verified process platform of both SiC- Shottky diode and SiC- MOSFET for customers design-in, and do available to co-develop for customized process. Except the foundry services for fabless design houses, Episil technologies is also capable for IDMs who looks for outside second source solution. |
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● HEMT Process List |
Wafer Size |
: 4" 6" |
Standard Process |
: JBS, DMOS |
Minimum width(CD) |
: 0.6um |
Etcher |
: SiC / SiO2 / Si3N4 / Poly / Metal, both Dry Etch and Wet Etch |
CVD |
: PSG / BPSG / TEOS, LPCVD / PECVD / APCVD |
Implant |
: B/P/Sb at room temp; Al/N/P 500°C at high temp |
Furnace |
: 1300°C ~1,900°C annealing, 900~1,350°C Oxides/N2O/NO/N2/Ar |
Anneal |
: RTP / Laser Anneal |
Grinding |
: down to 150um |
Metallization |
: Ti , TiN , Al/Cu , Ag , Au , Ni | |
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