Issued the 4th domestic secured convertible corporate bonds with a total par value of NT$1,000 million & 2,200,000 new shares issused for cash capital increase with a premium of NT$95 per share.
The Board of Directors approved the merger of subsidiary, Episil Technology Inc., and the name of the merged company was changed to Episil Technology Inc. (stock code 3707). The base date of the merger is 1 September 2021.
Issued the 3rd domestic secured convertible corporate bonds with a total par value of NT$600 million & 6,000,000 new shares issued for cash capital increase with a premium of NT$63.9 per share.
The subsidiary (Episil Technology Inc.) officially passed VDA6.3 certification.
The subsidiary (Episil Technology Inc.) obtained ISO 45001 transfer certification.
Election of the 3rd term board of directors (including independent directors) in the shareholders' meeting, with Chien-Hua Hsu re-elected as Chairman.
The subsidiary (Episil Technology Inc.) obtained ISO 14001:2015 and OHSAS 18001:2007 certification.
The subsidiary (Episil Technology Inc.)established a 6-inch SiC production line, deploying niche products, and continued to expand investment in SiC process business.
Issued the 2nd domestic secured convertible corporate bonds with a total par value of NT$750 million.
50,000,000 new shares were issued for cash capital increase with a premium of NT$11.85 per share.
Former Chairman Min-Chi Huang resigned and became honorary chairman, while the board of directors elected Director JH Shyu as the new Chairman.
Issued the 1st domestic secured convertible corporate bonds with a total par value of NT$650 million.
The subsidiary (Episil Semiconductor Wafer, Inc.) conducted a reverse merger with Precision Silicon Corp. Precision Silicon Corp. was the surviving company, and Episil Semiconductor Wafer, Inc. was the eliminated company. After the merger, Precision Silicon Corp. was renamed Episil-Precision Inc. the paid-in capital of Episil Precision Inc. increased from NT$940 million to NT$2.436 billion. The Company owns 61.4% shareholding of Episil Precision Inc. and became the largest shareholder.
The board of directors approved the merger of the subsidiary (Episil Semiconductor Wafer, Inc.) and Precision Silicon Corp.
The subsidiary (Episil Technology Inc.) continued to obtain ISO9001:2008 and ISO/TS16949:2009 certification.
The subsidiary (Episil Technology Inc.) split and transferred its epitaxial and compound semiconductor business to the newly established Episil Semiconductor Wafer, Inc., on January 5, 2015.,in order for industrial and technological specialization.
The policy of industrial holding and separate business operation was implemented,in order to expand the business development,improve operational performance and competitiveness.Passed the resolution of the shareholders’meeting of Episil Techology Inc.on June 6, 2014,the company was established via share conversion and listed on the OTC with the stock code of 3707.